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Polyamide hot melt adhedive fungible Henkel

Polyamide hot melt adhedive fungible Henkel

Low-pressure injection molding material, also known as polyamide hot melt adhesive, is a type of special injection molding material that has both adhesiveness and injection moldability. Its application field is between ordinary injection molding and chemical potting. It is especially suitable for temperature, Pressure-sensitive automotive industry and electronic and electrical fields.

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Material Chemistry

Industrial Chemicals

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Product introduction

ITEM NO	VISCOSITY	Softening point/℃	Hardness	Breaking strength/Mpa	Elongation at break %	Fungible
AL8202	200℃：2000～5000	155-170	30D-45D	≥4.0	≥500	Henkel6832
AL8205	230℃：2000～5000	190-200	40D-55D	≥9.0	≥300	Henkel6818
AL8207	210℃：2500～5000	170-180	30D-45D	≥5.0	≥500	Henkel646 Low viscosity
AL8208	200℃：1500～4500	150-165	80A-95A	≥2.0	≥150	Henkel6208
AL8246	240℃：2000～3500	165-175	28D-40D	≥4.0	≥500	Henkel646
AL8237	220℃：2500～6000	185-195	35D-50D	≥4.0	≥350	Henkel678
AL8205H	240℃：1500～4500	195-205	45D-55D	≥9.0	≥300	Henkel2035

Application of Polyamide hot melt adhedive fungible Henkel

It suitable for packaging and sealing protection of electronic, electrical, fiber optic components, switches, sensor circuit boards, relays, micro switches, precision components, nylon wires, bicycles, and electric vehicle connection lines in the automotive, home appliance, and medical related industries. LED lighting industry .

Features of Polyamide hot melt adhedive fungible Henkel
1.Low melt viscosity, good fluidity and wettability
2.Fast curing speed and suitable adhesion
3.Low VOC, halogen-free and environmentally friendly, compliant with EU RoHS standards
4.Excellent physical protection properties (waterproof, moisture-proof, electrical insulation)
5.Good flame retardancy

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